Method for forming bumps, semiconductor device, and solder paste

ABSTRACT

The present invention relates to a method for forming bumps on a substrate provided with electrode pads. The method includes providing a mask having openings corresponding to the electrode pads, filling each of the openings with a solder paste, and heat treating the solder paste, wherein the solder paste includes solder powder. Preferably, the solder powder contains no more than 10 wt % of particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, the solder powder contains no more than 10 wt % of particles whose diameter is not less than 40% the diameter of the opening portions, or no less than 30 wt % of particles whose diameter is 40 to 100% the thickness of the mask.

This is a division of application Ser. No. 09/746,336, filed Dec. 26,2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for forming bumps on electrodepads provided on a substrate, to an electronic component on which bumpsare formed, and to a solder paste.

2. Description of the Related Art

There has been a growing need for higher mounting density withelectronic components in recent years, and bare chip mounting methodshave been attracting attention. There are two types of bare chipmounting method: a face-up method involving wire bonding, and aface-down method featuring metal bumps. Face-down mounting is becomingmore and more prevalent today. A benefit of connecting with metal bumpsby face-down method is the lower resistance of the connection. On theother hand, numerous demands are imposed on this method, such as lowercost, ensuring a precise bump height in order to achieve stableconnection reliability, and forming bumps at a fine pitch correspondingto the electrode pads of a semiconductor chip.

Plating and vapor deposition are just two conventional ump formationmethods. These bump formation methods require a tremendous equipmentinvestment, and make it difficult to control bump height and metalcomposition, among other problems. In view of this, engineers have beentaking a closer look at printing, which allows a metal paste to besupplied at low cost.

One type of printing method makes use of a metal mask. In addition, asdisclosed in JP-A-7-273439 and JP-A-11-340270 and elsewhere, there isalso a method that utilizes a resin mask. When a metal mask is used, onein which openings have been formed corresponding to the locations wherethe electrode pads are formed is placed over a substrate. When a resinmask is used, a resin layer is formed over a substrate, after which theportions corresponding to the electrode pads are removed to formopenings. The two methods are similar in that after this, a squeegee isused to push a solder paste applied over the mask into the openings andthereby form bumps. When a metal mask is used, it is removed after theopenings have been filled with the solder paste, but when a resin maskis used, it is removed as needed after the bumps have been formed.

However, if a large proportion of the solder powder that makes up thesolder paste has a large particle diameter (such as an average particlediameter of 30 to 40 μm), there tends to be variance in the size of thebumps that are formed. Causes of this include the fact that some of thesolder powder that has filled the openings is wiped away when thesqueegee is moved back and forth over the mask, and that when the metalmask is removed after the openings have been filled with the solderpaste, the solder paste clinging to the inner walls of the openings endsup being taken away with the mask.

To avoid this problem it is necessary to use a solder powder with asmall proportion of particles whose diameter is large. For instance, itis good to use a solder powder with a large proportion of particleswhose diameter is no more than ⅓ the thickness of the mask (when thethickness of masks commonly in use is considered, this is substantiallya particle diameter of 15 μm or less).

Meanwhile, methods for producing a solder powder include disc atomizingand gas atomizing. With these methods it is difficult to stably producea powder with a small particle diameter. Accordingly, the currentapproach is to produce a powder having a particle size distributionwithin a certain range, and then separate and collect the fines.However, not only does separating out the fines require considerablelabor, it is also difficult to collect a large quantity of fines. Forinstance, with existing technology a solder powder of 20 μm or less onlyaccounts for about 20% of the total powder, which is alsodisadvantageous in terms of cost. Also, because a fine powder with asmall particle size has a larger specific surface area and is thereforeoxidized more readily, the solder paste made up of this solder powderhas a shorter life.

SUMMARY OF THE INVENTION

The bump formation method provided by the first aspect of the presentinvention is a method for forming bumps on a substrate provided with aplurality of electrode pads, comprising the steps of providing a maskhaving a plurality of openings corresponding to the plurality ofelectrode pads, filling each of the openings with a solder paste, andheat treating the solder paste, wherein the solder paste contains solderpowder and a flux vehicle, and the solder powder contains no more than10 wt % particles whose diameter is greater than the thickness of themask and no more than 1.5 times this thickness.

Unless otherwise specified, the term “substrate” as used in the presentinvention includes all substrates on which electrode pads are formed,which of course includes circuit substrates and silicon wafers, but alsoincludes semiconductor chips and so forth. When an opening is notcircular, “open diameter” refers to the diameter of a circle having asurface area equivalent to the surface area of the opening.

The solder paste used in this bump formation method must have a smallproportion of solder powder with a relatively large particle diameter ascompared to the thickness of the mask. This reduces the danger that thesolder paste filling the openings will be wiped away when the mask iscoated with the solder paste and a squeegee is then moved back and forthover the mask in an effort to pack the insides of the openings with thesolder paste. Also, when a metal mask is used, there will be less dangerthat the solder paste clinging to the inner walls of the openings willbe taken away with the metal mask when the mask is removed after theopenings have been filled with the solder paste. Accordingly, there willbe less variance in the bumps if they are formed by the above method.

The smaller is the quantity of solder powder within the above-mentionedparticle diameter range, the more pronounced this effect will be, andthe ideal proportion for such solder powder is therefore 0 wt %. For theabove effect to be realized even better, it is preferable to use no morethan 10 wt % solder powder having a particle diameter of 40% or more ofthe open diameter of the openings.

In a preferred embodiment, the solder powder contains at least 30 wt %,and preferably at least 50 wt %, particles whose diameter is 40 to 100%of the mask thickness.

This solder paste has a larger proportion of solder powder of suitableparticle size as compared to the mask thickness, and a smallerproportion of solder powder of relatively small particle size. If thethickness of the mask is about 50 to 100 μm, for example, then theproportion of solder powder having a particle diameter of 20 μm or lessis small. As discussed above, it used to be that preparing a solderpowder having a particle diameter of 20 μm or less not only was laborintensive, but also produced a low yield and was expensive, but if theproportion of solder powder with such a particle diameter is reduced,then these drawbacks are automatically ameliorated. Also, if theproportion of solder powder with a small particle diameter is small, thesolder powder as a whole is not as susceptible to oxidation, so anotheradvantage is a longer life for the solder paste.

The average particle diameter of the solder powder as a whole should besuitably determined as dictated by the thickness of the mask, thediameter of the openings formed therein, and so on, but is 5 to 20 μmfor example.

One or more elements selected from the group consisting of tin, lead,silver, antimony, bismuth, copper, indium, and zinc can be usedfavorably as the solder component that makes up the solder powder, forexample. More specifically, 63% Sn—Pb (melting point: 183° C.), Sn-3.5%Ag (melting point: 221° C.), 5% Sn—Pb (melting point: 315° C.), and thelike can be used to advantage.

Meanwhile, the flux vehicle can contain rosin, an activator, and asolvent.

The primary role of the rosin is to increase the adhesion of the solderpaste. A variety of known rosins can be used, examples of which includepolymerized rosin, hydrogenated rosin, and esterified rosin.

The primary role of the activator is to remove the oxidation film formedon the surface of the electrode pads or on the surface of the individualsolder powder particles when the solder paste is heat treated. Anorganic acid or an organic amine can be used, for example, as thisactivator. This is because, in most cases, an organic acid has carboxylgroups in the skeleton of the molecular structure, while an organicamine has amino groups in the skeleton of the molecular structure, soboth are able to remove the oxidation film from the solder powdersurface and the electrode surface in the solder paste.

At least one type of organic acid or organic amine selected from thegroup consisting of sebacic acid, succinic acid, adipic acid, glutaricacid, triethanolamine, and monoethanolamine is used as the activator.For the action of the activator to be maximized, it is preferable to useone that decomposes or vaporizes near the melting point of the solder.Meanwhile, at temperatures below the melting point of the solder, theactivator in the solder paste must be uniformly dispersed in the pastein order for its oxidation film removal effect to be maximized, so theuse of one that is miscible with the solvent or rosin is preferred.Accordingly, when an Sn—Ag-based solder is used, for instance, the useof sebacic acid (decomposition temperature: 230 to 290° C.), succinicacid (decomposition temperature: 200 to 250° C.), adipic acid(decomposition temperature: 230 to 280° C.), or the like is preferred.

The amount of activator contained in the solder paste is 0.1 to 2 wt %,for example. If the activator content is too high, it will lead toelevated viscosity of the solder paste, the fluidity of the solder pastewill suffer, and it will be difficult to fill the openings in the mask.On the other hand, if the activator content is too low, the oxidationfilm cannot be sufficiently removed from the solder powder, etc.

The primary role of the solvent is to adjust the viscosity of the solderpaste, which is adjusted to between 100 and 400 Pa·s, for example. Ifthe viscosity of the solder paste is lower than 100 Pa·s, when theopenings are filled with the solder paste, the resin part (rosin) willbe pushed out of the openings, and the wettability of the solder will beimpaired. On the other hand, if the viscosity of the solder paste isover 400 Pa·s, it will be difficult for the solder paste to flow intothe openings.

It is preferable for the solvent to comprise a combination of a firstsolvent having a boiling point lower than the melting point of thesolder powder, and a second solvent having a boiling point higher thanthe melting point of the solder powder.

With such a combination, when the solder paste is heated, the firstsolvent will vaporize before the solder powder melts, and the secondsolvent will vaporize after the solder powder has begun to melt. Theresult of this is that the first and second solvents ensure that thereis enough solvent to adjust the viscosity of the solder paste, whileallowing a reduction in the amount of solvent that vaporizes after thesolder powder has begun to melt. Consequently, less heat is robbed fromthe solder as heat of vaporization during the vaporization of thesolvent, and there is less drop in solder temperature during heating,which minimizes the problem of unmelted solder powder remaining behind.

Meanwhile, once the solder begins to melt, the second solvent begins tovaporize, but a specific amount of the second solvent remains for acertain length of time thereafter. A specific amount of solvent needs toremain when the solder is melted in order to maintain the fluidity ofthe rosin or other resin component and to keep the activator from beingtaken away along with the vaporization of the solvent, and thereby allowthe activator to fine its way into all the parts of the solder and actmost effectively. This is the role of the second solvent.

Thus, combining a first solvent with a second solvent ensures that theopenings in the mask will be properly filled with solder paste of thedesired viscosity, and the activator effectively acts to cause thesolder powder particles to fuse together, allowing solder bumps withlittle variance to be formed. As a result, it is possible to form solderbumps more precisely, and it is possible to form solder bumps accuratelyat a fine pitch on electrode pads provided at a fine pitch, as is thecase with semiconductor elements and so forth.

For this effect to be achieved in the best way, the first solvent ispreferably one that has a boiling point 5 to 50° C. lower than themelting point of the solder powder, and the second solvent is preferablyone that has a boiling point 5 to 50° C. higher than the melting pointof the solder powder. In other words, if the boiling point of the firstsolvent is too low, the first solvent may evaporate at room temperature,causing the viscosity of the solder paste to rise, but if the boilingpoint is too high, it will be close to the melting point of the solderpowder, making it impossible to sufficiently reduce the amount of heatrobbed by the vaporization of the first solvent when the solder powdermelts. Meanwhile, if the boiling point of the second solvent is toohigh, it will be impossible to sufficiently vaporize the second solventin the course of heating the solder paste, but if this boiling point istoo low, it will be close to the melting point of the solder powder, theactivator will be taken away as the second solvent vaporizes, and theactivator will not adequately fulfill its function.

The types of first and second solvents used are determined by themelting point of the solder, and mainly by the composition of the solderpowder. Table 1 below gives typical solder powder compositions andsuitable compositions for the first and second solvents.

TABLE 1 Solder powder Composi- tion (melting point/ First solvent Secondsolvent ° C.) Name (boiling point/° C.) Name (boiling point/° C.) 63%ethylene glycol monoethyl ethylene glycol diacetate Sn—Pb ether (135.0)(190.5) (183) n-butyl ether (140.9) propylene glycol (188.2) diethyleneglycol dimethyl 2-methyl-2,4-pentanediol ethyl ether (145.0) (197.0)ethylene glycol monomethyl ethylene glycol (197.7) ether acetate (145.1)ethylene glycol dibutyl methyl phenyl ether (153.9) ether (203.6)ethylene glycol monoethyl ethylene glycol monohexyl ether acetate(156.8) ether (208.3) diethylene glycol dimethyl n-butyl phenyl ether(213.3) ether (159.6) diethylene glycol mono- methoxymethoxyethanolethyl ether acetate (167.5) (217.4) ethyl phenyl ether (170.1)α-terpenol (218.0) propylene glycol monobutyl dipropylene glycol (229.2)monobutyl ether 1-butoxyethoxypropanol (171.1) (229.4) ethylene glycolmonobutyl diethylene glycol monobutyl ether (171.2) ether (230.4) Sn—ethylene glycol dipropylene glycol (229.2) 3.5% Ag isoamyl ether1-butoxyethoxypropanol (221) (181.0) (229.4) diethylene glycol diethyldiethylene glycol monobutyl ether (186.0) ether (230.4) ethylene glycolmonoacetate ethylene glycol monophenyl (187.0) ether (237.0) propyleneglycol (188.2) 1,5-pentanediol (242.5) dipropylene glycol tripropyleneglycol monomethyl ether (190.0) monomethyl ether (243.0) ethylene glycoldiacetate diethylene glycol (245.0) (190.5) diethylene glycol monobutylethylene glycol monobutyl ether acetate (246.8) ether acetate (191.5)diethylene glycol monoacetate diethylene glycol monomethyl (250.0) ether(194.2) diethylene glycol dibutyl diethylene glycol monoethyl ether(254.6) ether (195.0) ethylene glycol benzyl 2-methyl-2,4-pentanediolether (256.0) (197.0) ethylene glycol monophenyl 3,4-hexylene glycol(197.1) ether acetate (259.7) dipropylene glycol monoethyl glycerylmonobutyrate (269.0) ether (197.8) ethylene glycol dibutyl ether (203.6)ethylene glycol monohexyl ether (208.3) n-butyl phenyl ether (213.3) 5%glyceryl monobutyrate (269.0) benzyl benzoate (323.0) Sn—Pb dimethylphthalate (283.7) dibutyl phthalate (339.0) (315) diethyl phthalate(302.0) dioctyl phthalate (340.0) ethyl abietate (350.0) amyl stearate(360.0)

It is preferable for the first and second solvents each to be containedin an amount of 2 to 6 wt % in the solder paste in order for them tofulfill their above-mentioned roles as the first and second solvents.

A thixotropic agent may be admixed to the flux vehicle in order toimpart shape retention properties to the solder paste. Any of a varietyof known thixotropic agents can be used, such as hardened castor oil orhydroxystearic acid.

All of the components used as constituent components of the solder pastepreferably either contain no halogen elements or alkali metal elements,or contain these in extremely small amounts. This is because if halogenelements or alkali metal elements remain after the solder bumps havebeen formed, corrosion can cause degradation of the semiconductorelement, or migration can cause shorting between the electrodes. It isparticularly favorable for the halogen element and alkali metal elementcontent in the flux vehicle to be no more than 100 ppm.

In a preferred embodiment, the mask is provided over the substratethrough the steps of forming a first cover layer over the substrate,forming a second cover layer over this first cover layer, and formingthe plurality of openings in the first cover layer and the second coverlayer by exposing these to light in a pattern corresponding to theplurality of electrode pads and developing with an etchant, and thefirst cover layer is formed from a material that will be dissolved bythe etchant used to develop the second cover layer, with the etching ofthe first cover layer being carried out simultaneously with thedeveloping of the second cover layer.

With this bump formation method, just the portion of the second coverlayer corresponding to the electrode pads is selectively removed in thedeveloping that follows optical exposure, and first openings thatconstitute the above-mentioned openings are formed in the second coverlayer. Meanwhile, because the first cover layer is formed from amaterial that will be dissolved by the etchant used to develop thesecond cover layer, the first cover layer is also etched at the sametime by the above-mentioned etchant. Here, since the first cover layeris formed underneath the second cover layer, the second cover layer inwhich the first openings are formed functions as an etching mask for thefirst cover layer. Therefore, just the portion of the first cover layercorresponding to the electrode pads and corresponding to the firstopenings formed in the second cover layer is selectively removed to formsecond openings that constitute the above-mentioned openings. Thus, withthe above bump formation method, there is no need for the first coverlayer and the second cover layer to be etched separately in theformation of the openings, which is advantageous in that the work ismore efficient.

Unless otherwise specified, the term “optical exposure” encompassesirradiation with X-rays, an electron beam, or the like.

The material used to form the first cover layer should be one that willbe dissolved by the etchant used in the developing of the second coverlayer, and may be suitably selected as dictated by the type of etchantbeing used.

The material used to form the second cover layer is a macromolecularcompound that is photosensitive, or a mixture of a photosensitivecompound and another compound, for example, but can be either a negativetype in which the portion irradiated with light is cured, or a positivetype in which the portion irradiated with light is decomposed. Themeaning of the word “photosensitive” here is not limited to the propertyof undergoing curing (reaction) or decomposition (reaction) whenirradiated with light, and also encompasses the property of undergoingcuring (reaction) or decomposition (reaction) when irradiated with anelectron beam, X-rays, or the like.

Examples of materials with which a negative type cover layer can beformed include polymerizable vinyl group-containing vinyl esters,styrene, acrylic esters, methacrylic esters, and other such monomers, aswell as oligomers of these monomers, unsaturated polyester resins, andurea acrylates, and acrylic monomers and oligomers having polymerizableunsaturated double bonds. Naturally, a negative type cover layer may beformed from just a photosensitive compound, or it may be formed from amixture of a photosensitive compound and another compound, such as anacrylic-, epoxy-, or imide-based macromolecular compound.

Examples of materials with which a positive type cover layer can beformed include macromolecular compounds having ether bonds that readilyundergo photolysis (such as polyethylene oxide, cellulose, andpolyacetal), as well as polyethylene and other macromolecular compoundsthat readily produce radicals under optical irradiation, and mixtures oflow molecular weight compounds that are decomposed by opticalirradiation, such as diazo compounds, with another compound.

In a preferred embodiment, the first cover layer is formed from amaterial containing a macromolecule that is water-soluble or readilydissolves in an alkaline aqueous solution.

With this bump formation method, the second cover layer can be removedat the same time if at least the first cover layer is dissolved by wateror an aqueous solution such as an alkaline aqueous solution.Specifically, if the second cover layer is formed from a materialcontaining a macromolecule that is water-soluble or readily dissolves inan alkaline aqueous solution just as is the first cover layer, then thesecond cover layer can also be dissolved away at the same time by wateror an aqueous solution such as an alkaline aqueous solution. On theother hand, if the second cover layer is formed from a material thatcontains as its main component a macromolecule has poor solubility inwater or in an alkaline aqueous solution, then just the first coverlayer can be dissolved. Since the first cover layer is formed underneaththe second cover layer, once the first cover layer is dissolved, thesecond cover layer will no longer be attached to the substrate. In thisstate, the second cover layer can be easily removed in the form of afilm, even if the second cover layer itself is not dissolved. Sincethere is no need to dissolve the second cover layer in this case, anadvantage is that less water or aqueous solution such as an alkalineaqueous solution is used. Therefore, in this respect it is preferable toform the second cover layer from a material whose main component is amacromolecular that has poor solubility in water or in an alkalineaqueous solution.

When the second cover layer has poor solubility in water or in analkaline aqueous solution, it is preferable for the second cover layerto contain a macromolecule based on an acrylic (such as an acrylicester), an epoxy (such as a bisphenol A type), or an imide (such as abismaleimide type of polyimide). Naturally, a combination of thesemacromolecules may also be used.

The macromolecule that is water-soluble or readily dissolves in analkaline aqueous solution and is contained in the first cover layer canbe a natural macromolecule such as animal-derived gelatin orvegetable-derived starch, a semi-synthetic macromolecule such as astarch derivative or a cellulose derivative, as well as various othermacromolecules. Homopolymers (straight polymers) and copolymers can bothbe used as synthetic macromolecules. Examples of homopolymers includepolyvinyl alcohol, polyvinyl pyrrolidone, and other vinyl-basedpolymers, polyacrylamide, polyacrylic acid, and other acrylic Polymers,and polyethylene oxide. Examples of copolymers include random copolymerssuch as a partially saponified polyvinyl acetate, block copolymers suchas poly(styrene-ethylene oxide), and graft copolymers such aspoly(ethylene-vinyl alcohol)-g-(ethylene oxide).

In a preferred embodiment, the plurality of electrode pads are dividedinto a plurality of groups, and the mask is formed through the steps offorming a cover layer so as to cover the plurality of electrode pads,and forming the plurality of openings in this cover layer in a patterncorresponding to the plurality of electrode pads, with the volume ofthese openings being different for each group.

With this bump formation method, the amount of solder paste filling thevarious openings is different for each group of electrode pads.Accordingly, it is possible for the bums formed on the electrode pads tobe different sizes for each group.

For example, if first openings formed corresponding to the variousmembers of a first electrode pad group out of a plurality of groups arelarger in volume than second openings formed corresponding to thevarious members of a second electrode pad group out of a plurality ofgroups, then the amount of solder paste filling the first openings willbe greater than the amount of solder paste filling the second openings.Accordingly, when the bumps are finally formed, those bumps formed onthe first electrode pads will be larger than the bumps formed on thesecond electrode pads.

In a preferred embodiment, the plurality of electrode pads are dividedinto a group comprising a plurality of first electrode pads and a groupcomprising a plurality of second electrode pads, each of the firstelectrode pads being formed in a surface area smaller than each of thesecond electrode pads, and the plurality of openings include a pluralityof first openings formed in a pattern corresponding to the plurality offirst electrode pads, and a plurality of second openings each smaller involume than each of the first openings and formed in a patterncorresponding to the plurality of second electrode pads.

With this bump formation method, if the thickness of the cover layer isuniform under conditions in which no molten solder is in contact withthe inner walls of the openings when the solder is melted, for instance,then the solder bumps will be taller when formed in openings of greatervolume. In other words, the larger is an opening, the greater is theamount of solder paste that fills it, so the bump formed on thatelectrode pad will be taller. If an electrode pad is small, then therewill be less contact surface area between the electrode pad and thebump, and the bump will be closer to spherical in shape, so the heightof the bumps can be varied in this respect as well.

Thus, if openings of different size are formed in the cover layer, andthe surface area of the electrode pads is also different, then aplurality of bump groups of varying distance from the electrode pads tothe bump tops can be formed simultaneously and in the same step.

The above description is of an example in which two types of bump withdifferent heights are formed, but of course the present invention canalso be applied to when three or more types of bump of different heightsare formed. For instance, in addition to first and second openings ofdifferent, open volume, third openings with yet a different volume maybe provided, and of course fourth or further openings may also beprovided.

The cover layer is formed, for example, by coating with a molten resin,or laying down a resin film. However, forming the cover layer by layingdown a resin film is advantageous, not only because the step of formingthe cover layer is easier, but also because it is possible to form acover layer of uniform thickness with ease.

The cover layer can be made up of a highly insulating resin based on aresin such as polymethyl methacrylate, polyacrylate, or polymethylisopropenyl ketone, and is preferably made up of a photosensitivematerial containing a photopolymerizable monomer such as apolyfunctional acrylate.

In a preferred embodiment, wherein the plurality of electrode padsinclude a plurality of first electrode pads and a plurality of secondelectrode pads, and the plurality of openings include a plurality offirst openings, a plurality of second openings, and a plurality of thirdopenings, and the mask is formed through the steps of forming a firstcover layer by covering the plurality of first electrode pads andexposing the plurality of second electrode pads, forming the pluralityof first openings in this first cover layer in a pattern correspondingto the plurality of first electrode pads, forming a second cover layerso as to cover the first cover layer and the plurality of secondelectrode pads, forming the plurality of second openings in the secondcover layer in a pattern corresponding to the plurality of secondelectrode pads, and forming the plurality of third openings in a patterncorresponding to the plurality of first openings.

With this bump formation method, a mask is constituted by the firstcover layer and the second cover layer in the region where the firstelectrode pads are formed, and the mask is constituted by only thesecond cover layer in the region where the second electrode pads areformed. The first and third openings are provided over the firstelectrode pads, and the second openings are formed over the secondelectrode pads. Since the second and third openings are both formed inthe second cover layer, if the thickness of the second cover layer isuniform, the depth of these openings will be the same. Accordingly, theopenings formed over the first electrode pads are deeper than thoseformed over the second electrode pads by the depth of the first openings(the thickness of the first cover layer). Therefore, when theabove-mentioned mask is used, the amount of solder paste resting on thefirst electrode pads will be greater than that resting on the secondelectrode pads, and the solder bumps formed thereon will also be taller.As a result, with this bump formation method, it is possible to form aplurality of bump groups with significantly varying distances from thesubstrate surface to the bump tops.

The third openings are preferably formed larger than the secondopenings. If they are, then the amount of solder paste resting on thefirst electrode pads will be larger than the amount of solder pasteresting on the second electrode pads, and as a result the height of thebumps formed on the first electrode pads can be significantly differentfrom the height of the bumps formed on the second electrode pads.

In a preferred embodiment, the third openings are formed with a largeropen surface area than the first openings, and there is further includeda step of selectively removing just the second cover layer, with thefirst cover layer left on the substrate.

With this bump formation method, the first cover layer, which has firstopenings with a smaller open surface area than the third openings,remains after the bumps have been formed, so bumps in which a sphericalportion, example, protrudes from the surface of the first cover layerare formed over the first electrode pads such that they are raised up tothe remaining first cover layer. Meanwhile, spherical bumps, forexample, are formed directly on the second electrode pads. Accordingly,a height difference can be achieved between the bumps over the firstelectrode pads and the bumps over the second electrode pads.

The first and second cover layers are formed, for example, by coatingwith a molten resin, or laying down a resin film. However, forming thecover layers by laying down a resin film is advantageous, not onlybecause the step of forming the cover layer is easier, but also becauseit is possible to form a cover layer of uniform thickness with ease.

The first cover layer can be made up of a highly insulating resin basedon a resin such as epoxyacrylate, epoxy, and polyimide.

The second cover layer can be made up of a highly insulating resin basedon a resin such as polymethyl methacrylate, polyacrylate, or polymethylisopropenyl ketone, and is preferably made up of a photosensitivematerial containing a photopolymerizable monomer such as apolyfunctional acrylate. The first cover layer must be a material thatexhibits chemical properties different from those of the second resinfilm so that it will not be etched by the etchant when the second andthird openings are formed in the second resin film. For example, thefirst resin film can be made up of a material such as epoxyacrylate,epoxy, and polyimide. If it is, not only will the step of forming theresin film be easier, but it will also be possible to form a resin filmof uniform thickness with ease.

In a preferred embodiment, the filling of the openings with solder pasteis carried out through the steps of holding the substrate on a substratesupport, providing squeegeeing helper means for lessening the differencebetween the height position of the mask and the height position of theperiphery of the substrate, readying solder paste on the mask or thesqueegeeing helper means, and moving a squeegee to push the solder pastedown into the openings.

The filling of the openings with the solder paste need only comprise thevarious steps listed above, and does not necessarily have to follow theabove order. For instance, the openings may be formed after theformation of the cover layers on the substrate, and the openings thenwith the solder paste while the substrate is held on a substratesupport.

With this bump formation method, the provision of the squeegeeing helpermeans lessens the difference between the height position of the mask andthe height position of the periphery of the substrate. Accordingly, thesqueegee can be moved not only over the cover layer, but also over thesqueegeeing helper means. In other words, not only the solder paste onthe substrate, but also the solder paste on the squeegeeing helper meanscan be moved at the same time and used to fill in the openings. Thismeans that the various openings can be filled with solder paste easilyand reliably even when the bumps are being formed on a substrate withuneven width dimensions (such as a silicon wafer).

As shown in FIG. 18a, when bumps were formed on electrode pads 15 a of adisk-shaped substrate 15 such as a silicon wafer, the following problemswere encountered in the filling of the openings 16 a in a mask 16 with asolder paste P. The filling of the openings 16 a with the solder paste Pwas carried out by readying the solder paste P along a specific edge 16Aof the mask 16 and moving a squeegee S to the edge 16B on the oppositeside. Here, if we look at the movement path of the squeegee S, we seethat, as shown in FIG. 18b, the size of the substrate 15 (mask 16) inthe direction perpendicular to the movement direction of the squeegee Sincreases along with the movement of the squeegee S at first, butdecreases after passing the widest portion. Therefore, if the solderpaste P is readied near the starting point of the squeegee S, the solderpaste P can only be moved in a width roughly corresponding to the lengthof the readied solder paste P. This makes it difficult to properly fillthe openings 16 a′ formed along the edge of the above-mentioned widestportion with a sufficient amount of the solder paste P′. Also, if theopenings 16 a are formed right up to the edge of the mask 16, then whenthe squeegee S is moved up to the opposite edge 16B of the mask 16 inorder to fill these openings 16 a with the solder paste, the solderpaste P will end up being scraped off the mask 16. Accordingly, thissolder paste P cannot be moved back to the starting portion of thesqueegee S by using the squeegee S, which is a problem in that thesolder paste is not utilized effectively.

In contrast, with the above-mentioned solder bump formation method, theperiphery of the substrate is surrounded by the squeegeeing helpermeans, so if the squeegeeing helper means is taken into account, thesize in the direction perpendicular to the movement direction of thesqueegee can be made larger than the widest section of the substrate,and the distance that the squeegee moves can also be made larger thanthe substrate.

Therefore, if solder paste is readied on the cover layer or on thesqueegeeing helper means so as to correspond to, or be longer than, thewidest section of the substrate, and this is moved by the squeegee, theneven those openings formed at the widest section of the substrate, or inthe vicinity thereof, can be properly filled with solder paste. Also, ifthe distance the squeegee moves during filling can be made larger, thenthe solder paste can be moved back on the squeegeeing helper means evenwhen the squeegee has reached the edge of the substrate, so this solderpaste can be reused.

For this effect to be achieved in the best way, it is preferable for thesqueegeeing helper means and the cover layer to be in the same orapproximately the same plane, but as long as the movement of thesqueegee is not hindered, there may be some difference in the height ofthese.

The squeegeeing helper means is provided by forming a resin layer so asto surround the periphery of the substrate, or by disposing a plate orthe like having an opening corresponding to the shape of the substrateso as to surround the periphery of the substrate. The squeegeeing helpermeans may have an opening through which all of the openings provided tothe cover layer can be exposed, and as long as the movement of thesqueegee is not hindered, the squeegeeing helper means may be providedso that it covers the cover layer, and the surface of the squeegeeinghelper means is higher than the surface of the cover layer. Naturally,to the extent that the object of the present invention can still beachieved, the squeegeeing helper means does not necessarily have to beprovided so as to surround the entire periphery of the substrate, andneed only be provided to the required region of the substrate periphery.Also, the squeegeeing helper means does not necessarily have to beprovided as a single integrated member or element, and a plurality ofmembers or elements may be combined to make up the squeegeeing helpermeans.

However, the resin layer cannot be reused after it has been removedfollowing bump formation, but a plate can be used over and over, so inthis respect it is preferable to provide the squeegeeing helper means bydisposing a plate. Also, if the squeegeeing helper means comprises aplate, any excess solder paste that did not fill the openings in thecover layer can be moved back on the squeegeeing helper means, and thissolder paste that has been moved back to the squeegeeing helper meanscan be reused in the formation of bumps on the next substrate.

When the squeegeeing helper means is formed from a resin layer, it ispreferable to form the resin layer from a material that dissolves in thesame etchant as the cover layer, for example, in order to remove theresin layer at the same time in the removal of the cover layer.

Meanwhile, it is preferable for the substrate support to have a recesscapable of accommodating at least part of the substrate. If it does,then movement of the substrate with respect to the substrate support canbe restricted even when the squeegee is moved over the substrate inorder to fill the openings with the solder paste. Since the substratecan be set in place on the substrate support just by placing thesubstrate in the recess, and does not need to be fixed to the substratesupport with an adhesive or the like, this is advantageous in terms ofboth cost and work efficiency.

The bump formation method provided by the second aspect of the presentinvention is a method for forming bumps on a substrate provided with aplurality of electrode pads, comprising the steps of forming a firstcover layer over the substrate, forming a second cover layer over thefirst cover layer, forming a plurality of openings corresponding to theplurality of electrode pads in the first cover layer and the secondcover layer by exposing these to light and developing with an etchant,filling each of the openings with metal, and heating the metal tointegrate it with the electrode pads, wherein the first cover layer isformed from a material that will be dissolved by the etchant used todevelop the second cover layer, and the first cover layer is etched toform the plurality of openings simultaneously with the developing of thesecond cover layer.

With this bump formation method, at the same time that the firstopenings constituting the above-mentioned openings are formed in thesecond cover layer by the etching of the second cover layer, the secondopenings constituting the above-mentioned openings are also formed inthe first cover layer using the second cover layer as a mask. Therefore,openings can be formed substantially in the second cover layer byetching without separately etching the cover layers in the formation ofthe openings.

In a preferred embodiment, the first cover layer is formed from amaterial containing a macromolecule that is water-soluble or readilydissolves in an alkaline aqueous solution.

With this bump formation method, the second cover layer dissolves at thesame time if at least the first cover layer is dissolved by water or anaqueous solution such as an alkaline aqueous solution, or the secondcover layer is separated from the substrate, so the entire mask can beremoved.

The bump formation method provided by the third aspect of the presentinvention is a method for forming bumps on a substrate provided with aplurality of electrode pads divided into a plurality of groups,comprising the steps of forming a mask having a plurality of openingscorresponding to the plurality of electrode pads such that the size isdifferent for each group, filling the openings with solder paste,forming bumps from the solder paste by heat treatment, and removing thecover layer from the substrate.

With this bump formation method, the amount of solder paste filling thevarious openings is different for each group of electrode pads.Accordingly, it is possible for the bums formed on the electrode pads tobe different sizes, and for the height of the bumps to be different foreach group.

One way to make the height of the bumps different for each group is todivide the plurality of into a group of first electrode pad groups and agroup of second electrode pads with a larger surface area, and make thevolume of the first openings formed in a pattern corresponding to thefirst electrode pads smaller than the volume of the second openingscorresponding to the second electrode pads.

The larger the amount of solder paste on the electrode pads, the largerthe bumps will be formed, and if the thickness of the cover layer isuniform and the molten solder does not touch the inner walls of theopenings, then the smaller is the surface area of the electrode pads,the taller the bumps will be. Accordingly, if the relationship betweenthe openings and the electrode pads is as above, then bumps of differentheights can be formed more reliably.

The cover layer is formed, for example, by coating with a molten resin,or laying down a resin film. Examples of the component that makes upthis cover layer include polymethyl methacrylate, polyacrylate, orpolymethyl isopropenyl ketone. These components may be used singly or incombinations of two or more types.

The bump formation method provided by the fourth aspect of the presentinvention is a method for forming bumps on a substrate provided with aplurality of first electrode pads and a plurality of second electrodepads, comprising the steps of forming a first cover layer in a state inwhich the plurality of first electrode pads are covered and theplurality of second electrode pads are exposed, forming a plurality offirst openings in the first cover layer in a pattern corresponding tothe plurality of first electrode pads, forming a second cover layer soas to cover the first cover layer and the plurality of second electrodepads, forming a plurality of second openings in the second cover layerin a pattern corresponding to the plurality of second electrode pads,and forming a plurality of third openings in a pattern corresponding tothe plurality of first openings, filling the first openings, secondopenings, and third openings with solder paste, forming bumps from thesolder paste by heat treatment, and removing the second cover layer.

With this bump formation method, the thickness of the mask is differentin the region in which the first electrode pads are formed and in theregion in which the second electrode pads are formed. Therefore, theheight is different between the bumps formed on the first electrode padsand the bumps formed on the second electrode pads.

It is preferable for the surface area of the third openings to be madelarger than that of the second openings in order to make the amounts ofsolder paste filling the insides of the second and third openingsmarkedly different and to achieve a good difference in height betweenthe bumps on the first electrode pads and those on the second electrodepads.

Also, the third openings may be formed with a larger open surface areathan the first openings, and just the second cover layer may beselectively removed, with the first cover layer left on the substrate.

If this is done, the first cover layer remains after the bumps have beenformed, so bumps in which a spherical portion, example, protrudes fromthe surface of the first cover layer are formed over the first electrodepads such that they are raised up to the remaining first cover layer.Meanwhile, spherical bumps, for example, are formed directly on thesecond electrode pads. Accordingly, a good difference in height can beobtained between the bumps over the first electrode pads and the bumpsover the second electrode pads.

The first and second cover layers are formed, for example, by coatingthe substrate with a molten resin, or laying a resin film over thesubstrate.

The first cover layer can be made up of a highly insulating resin basedon a resin such as epoxyacrylate, epoxy, and polyimide.

The second cover layer can be made up of a highly insulating resin basedon a resin such as polymethyl methacrylate, polyacrylate, or polymethylisopropenyl ketone.

The bump formation method provided by the fifth aspect of the presentinvention is a method for forming bumps on a substrate provided with aplurality of electrode pads, comprising the steps of holding thesubstrate on a substrate support, forming a cover layer so as to coverat least the substrate, forming a plurality of openings in the coverlayer in a pattern corresponding to the plurality of electrode pads,providing squeegeeing helper means for lessening the difference betweenthe height position of the cover layer on the substrate and the heightposition of the periphery of the substrate, readying a metal paste(including solder paste) or metal powder on the cover layer or thesqueegeeing helper means, moving a squeegee to push the metal paste ormetal powder down into the openings, heating, melting, and solidifyingthe metal paste or metal powder to integrate it on the electrode pads,and taking away the squeegeeing helper means.

This bump formation method need only comprise the various steps listedabove, and does not necessarily have to follow the above order. Forinstance, the openings may be formed after the formation of the coverlayer on the substrate, and the openings then filled with the solderpaste while the substrate is held on a substrate support.

With this bump formation method, the provision of the squeegeeing helpermeans lessens the difference between the height position of the mask andthe height position of the periphery of the substrate. Accordingly, themetal powder or metal paste can be moved not only over the cover layer,but also by utilizing the squeegeeing helper means, allowing theindividual openings to be reliably filled with metal powder, etc., evenwhen the bumps are formed on a substrate whose width is not even.

For this effect to be achieved in the best way, it is preferable for thesqueegeeing helper means and the cover layer to be in the same orapproximately the same plane, but as long as the movement of thesqueegee is not hindered, there may be some difference in the height ofthese.

The squeegeeing helper means is provided by forming a resin layer so asto surround the periphery of the substrate, or by disposing a plate orthe like having an opening corresponding to the shape of the substrateso as to surround the periphery of the substrate. The squeegeeing helpermeans may have an opening through which all of the openings provided tothe cover layer can be exposed, and as long as the movement of thesqueegee is not hindered, the squeegeeing helper means may be providedso that it covers the cover layer, and the surface of the squeegeeinghelper means is higher than the surface of the cover layer.

Meanwhile, it is preferable for the substrate support to have a recesscapable of accommodating at least part of the substrate. If it does,then movement of the substrate with respect to the substrate support canbe restricted, allowing the squeegee to move more smoothly.

In all of the first to fifth aspects of the present invention discussedabove, it is preferable if there is further provided a step of applyingflux to the bumps formed from heat treated solder paste, and performinga heat treatment again to adjust the shape of the bumps.

A flux containing Polypale and hexylene glycol is used, for example.

In all of the first to fifth aspects of the present invention discussedabove, it is preferable if the open surface area of the openings is nomore than 25 times the surface area of the corresponding electrode pads.If it is, the molten solder can be gathered more reliably on theelectrode pads when the solder is melted, allowing the solder to beformed in good spherical shapes.

The sixth aspect of the present invention provides an electroniccomponent, comprising a substrate, a plurality of first electrode padsand a plurality of second electrode pads formed on the same surface ofthis substrate, a plurality of first bumps formed in a patterncorresponding to the plurality of first electrode pads, and a pluralityof second bumps formed in a pattern corresponding to the plurality ofsecond electrode pads, wherein the surface area of each of the firstelectrode pads is smaller than the surface area of each of the secondelectrode pads, and the top of each of the first bumps is located higherthan the top of each of the second bumps.

The seventh aspect of the present invention provides an electroniccomponent, comprising a substrate, a plurality of first electrode padsand a plurality of second electrode pads formed on the same surface ofthis substrate, a cover layer formed in the region of the substratewhere the plurality of first electrode pads are formed and having aplurality of openings corresponding to the plurality of first electrodepads, a plurality of first bumps provided in a pattern corresponding tothe plurality of first electrode pads, with spherical portionsprotruding from the cover layer, and a plurality of second bumpsprovided in a pattern corresponding to the plurality of second electrodepads, with spherical portions formed directly on the correspondingsecond electrode pads, wherein the top of each of the first bumps islocated higher than the top of each of the second bumps.

The cover layer can be made from a highly insulating resin based on anepoxyacrylate, epoxy, polyimide, or other such resin.

A preferred embodiment of the electronic components discussed in theabove-mentioned sixth and seventh aspects of the present invention is anelectronic component further comprising a mounting object, wherein thismounting object is placed on the substrate with the plurality of secondbumps therebetween, and the top of each of the first bumps is located ata height of at least 1.2 times the height location of the top of themounting object.

With this structure, an additional mounting object can be placed on thesubstrate via the first bumps in a state in which the original mountingobject is interposed between the additional mounting object and thesubstrate, or the substrate can be mounted on another substrate via thefirst bumps. Employing this structure affords higher mounting efficiencyin the mounting of an electronic component on the substrate, and allowsfor a more compact electronic component consisting of a plurality ofsemiconductor chips or the like.

An electronic component having two kinds of bumps of different size wasdescribed in the sixth and seventh aspects of the present invention,while a method for forming two kinds of bumps of different size asneeded was described in the first through fourth aspects of the presentinvention. However, when three or more kinds of bump of different sizeare to be formed, the present invention can be applied whenever any twobumps are of different size, and is not necessarily limited to when twokinds of bump of different size are formed.

The eighth aspect of the present invention provides a solder pastecontaining a solder powder and a solvent, wherein the solvent contains afirst solvent having a boiling point lower than the melting point of thesolder powder, and a second solvent having a boiling-point higher thanthe melting point of the solder powder.

This solder paste can be used favorably in the formation of secondbumps. In a preferred embodiment, the same solder paste as thatdiscussed in the eighth aspect of the present invention can also be usedin the first aspect of the present invention. Therefore, when the solderpaste of the eighth aspect of the present invention is used to formsecond bumps, the same effects will be realized as when the solder pasteof the first aspect of the present invention was used.

Specifically, since the first solvent has already vaporized in themelting of the solder, less heat is robbed from the solder through heatof vaporization of the solvent after the solder begins to melt, theeffect being an amelioration of the problem of unmelted solder powderbeing left behind. Because a specific amount of the second solventremains even after the solder has melted, the fluidity of the rosin orother resin component is maintained, the activator is not carried awayas the solvent is vaporized, and the activator is able to get into allparts of the solder, allowing it to act more effectively. As a result,it is possible to form solder bumps with a good spherical shape and novariance in size.

For this effect to be obtained in an even better way, it is preferablefor the first solvent to have a melting point to 5 to 50° C. lower thanthe melting point of the solder powder, and for the second solvent tohave a melting point 5 to 50° C. higher than the melting point of thesolder powder. For the same reason, it is preferable for the firstsolvent to be contained in the solder paste in an amount of 2 to 6 wt %,and the second solvent in an amount of 2 to 6 wt %.

The types of first and second solvent to be used will be determined bythe type (melting point) of the solder powder being used, and in theeighth aspect of the present invention, it is again preferable to usethose listed as examples for the first aspect of the present invention(see Table 1).

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1a to 1 e are cross sections illustrating the steps of forming amask in the bump formation method pertaining to a first embodiment ofthe present invention;

FIGS. 2a and 2 b are a cross section and a plan view illustrating thestep of providing the squeegeeing helper means around the substrate;

FIGS. 3a and 3 b are a cross section and a plan view illustrating theprinting step;

FIGS. 4a and 4 b are a cross section and a plan view illustrating theprinting step;

FIGS. 5a to 5 d are cross sections illustrating the final bump formationsteps;

FIGS. 6a to 6 f are cross sections illustrating the bump formationmethod pertaining to a second embodiment of the present invention;

FIG. 7a is a cross section giving an enlarged detail view of FIG. 6a,and FIG. 7b is a cross section giving an enlarged detail view of FIG.6b;

FIG. 8 is a perspective view showing an example of an electronic elementobtained through the bump formation method pertaining to the secondembodiment of the present invention;

FIG. 9 is a perspective view showing the state in which sub-chips aremounted on an electronic element (main chip) in FIG. 8;

FIGS. 10a and 10 b are perspective views illustrating the steps ofmounting the sub-chips on the electronic element (main chip) in FIG. 8;

FIG. 11 is a perspective view showing the state in which the main chipin the state in FIG. 9 is mounted on a rewired substrate;

FIGS. 12a and 12 b are cross sections showing the state in which themain chip is mounted on a rewired susbtrate;

FIGS. 13a to 13 h are cross sections illustrating the bump formationmethod pertaining to a third embodiment of the present invention;

FIGS. 14a to 14 d are cross sections showing the state in which asub-chip is mounted on the electronic element (main chip) in FIG. 13,and this assembly is mounted on a rewired substrate;

FIG. 15 is a cross section of the semiconductor chip in a fourthembodiment pertaining to the present invention;

FIG. 16 is a cross section showing the state in which sub-chips aremounted on the semiconductor chip in FIG. 15;

FIG. 17 is a cross section showing the state in which a semiconductorchip in the state in FIG. 16 is placed on a rewired substrate; and

FIGS. 18a and 18 b are a cross section and a plan view illustrating theprinting step in a conventional bump formation method.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will now be described indetail through reference to the drawings.

First, the bump formation method pertaining to the first embodiment ofthe present invention will be described in specific terms throughreference to FIGS. 1 to 5. In this first embodiment we will describe themethod for forming bumps on a circular substrate.

The bump formation method pertaining to the first embodiment is broadlydivided into a step in which a mask is formed, a step in which asqueegeeing helper means is provided, a printing step, and a step inwhich the bumps are finally formed.

The step of forming a mask involves positioning a substrate 1 shown inFIG. 1a, forming a first cover layer 21 shown in FIG. 1b, forming asecond cover layer 22 shown in FIG. 1c, and forming openings 23 shown inFIGS. 1d and 1 e.

The positioning of the substrate 1 is performed by putting the substrate1 inside a recess 40 in a substrate support 4 as shown in FIG. 1a. Therecess 40 has an open surface area corresponding to the plan viewsurface area of the substrate 1, but its depth is less than thethickness of the substrate 1. Accordingly, only the lower part of thesubstrate 1 fits into and is positioned in the recess 40, whichrestricts the movement of the substrate 1.

When the substrate 1 is positioned in this way, there is no need to usean adhesive or the like to fix the substrate 1 to the substrate support4, which makes the work easier. A plurality of electrode pads 10 areprovided to the substrate 1.

The formation of the first cover layer 21 is performed by coating thesubstrate 1 with a solution of a polyacrylic acid, polyvinyl alcohol, orother such macromolecule with high water solubility by a know processsuch as spin coating or screen printing (see FIG. 1b). The thickness ofthe first cover layer 21 is set to about 0.01 to 10 μm, for example.

The formation of the second-cover layer 22 is performed by subjecting aresin film containing a highly photopolymerizable or photodegradable(photosensitive) material to hot press bonding over the first coverlayer 21 (see FIG. 1c). This resin film is a negative type in which theportion irradiated with light is polymerized, for example; specifically,it comprises a photopolymerization initiator mixed with an acrylic esteror methacrylic ester. The thickness of the second cover layer 22 is setaccording to the height of the bumps to be formed and the thickness ofthe first cover layer 21, but when the height of the bumps is 75 μm, forexample, this thickness is about 20 to 60 μm.

The formation of the openings 23 is performed by forming second openings22 a corresponding to the second cover layer 22 and, at the same time,forming first openings 21 a corresponding to the first cover layer 21,as shown in FIGS. 1d and 1 e.

In the formation of the second openings 22 a, when the second coverlayer 22 is formed using a negative type resin, for example, first theportion corresponding to the electrode pads 10 is irradiated with lightin a state in which a photomask 5 with an opaque component 50 is inplace, as shown in FIG. 1d. Then, as shown in FIG. 1e, the photomask 5is taken off, and the second openings 22 a are formed by removing theportion not irradiated with light (non-polymerized component) using anetchant such as a tetramethylammonium hydroxide aqueous solution. Here,the second cover layer 22 in which the second openings 22 a are formedfunctions as a mask for the first cover layer 21. If the first coverlayer 21 is formed from a highly water-soluble macromolecular material,then the first cover layer 21 will also be selectively removed only inthe portion corresponding to the electrode pads 10, forming the firstopenings 21 a. The openings 23 (21 a and 22 a) are thus formed in thefirst and second cover layers 21 and 22, and a mask 2 is formed suchthat it covers the substrate 1 and leaves the electrode pads 10 exposed.

The open surface area of the openings 23 is preferably no more than 25times the surface area of the electrode pads 10.

The step of forming the squeegeeing helper means is carried out bydisposing a rectangular frame-shaped plate 6 with an opening 60 formedin its middle, such that it surrounds the substrate 1 as shown in FIGS.2a and 2 b. The plate 6 is entirely formed from a resin such as Teflonor a metal such as stainless steel. The opening 60 in the plate 6 has anopen surface area substantially corresponding to the plan view surfacearea of the substrate 1, and the thickness of the plate 6 substantiallycorresponds to the difference between the height location of the secondcover layer 22 on the substrate 1 and the height location of the secondcover layer 22 around the substrate 1. Accordingly, with the plate 6 inplace, the height location of the second cover layer 22 around thesubstrate 1 is the same or substantially the same as the height locationof the second cover layer 22 on the substrate 1. As a result, thesqueegee S, the solder paste P, etc., can be moved not only over thesecond cover layer 22 on the substrate 1, but also over the squeegeeinghelper means 6 (see FIGS. 3 and 4).

Naturally, to the extent that movement of the squeegee S is not lost,there may be a difference in the height locations of the squeegeeinghelper means 6 and the second cover layer 22. In this case, the heightlocation of the second cover layer. 22 may be about 200 μm, for example,lower than the squeegeeing helper means 6.

The printing step is carried out by moving the solder paste P with thesqueegee S as shown in FIGS. 3a, 3 b, 4 a, and 4 b so as to fill theopenings 23 with the solder paste P.

First, as shown in FIGS. 3a and 3 b, solder paste P is readied on thesecond cover layer 22 and the squeegeeing helper means 6 around theedges of the squeegeeing helper means 6. Here, the length L of theregion in which the solder paste P is readied is preferably longer thanthe maximum width w of the substrate 1. In this embodiment, thesqueegeeing helper means 6 is provided so as to be the same orsubstantially the same height as the second cover layer 22, so thesqueegeeing helper means 6 is also utilized to ready the solder paste P.Doing so allows the solder paste P to be readied so as to be longer thanthe maximum width W of the substrate 1 even when the width of thesubstrate 1 is not consistent. In this case, the squeegee S is longerthan the maximum width W of the substrate 1.

The solder paste P used in this printing step is one that containssolder powder and a flux vehicle, and preferably has a viscosity of 100to 400 Pa·s.

Tin, lead, bismuth, zinc, copper, cadmium, antimony, and other suchcomponents can be used for the solder, with typical examples including63% Sn—Pb, Sn-3.5% Ag, and 5% Sn—Pb.

The solder powder that is used contains no more than 10 wt % particleswhose diameter is greater than the thickness of the mask 2 and no morethan 1.5 times this thickness, for example. Preferably, the solderpowder contains no more than 10 wt % particles with a diameter of 40% ormore of the open diameter of the openings 23, and even more preferably,contains at least 30 wt % particles whose diameter is 40 to 100% of thethickness of the mask 2.

The flux vehicle contains rosin, an activator, and a solvent, andpreferably the combined content of halogen elements and alkali metalelements is no more than 100 ppm.

The rosin can be polymerized rosin, hydrogenated rosin, esterifiedrosin, or the like. The amount in which the rosin is contained in thesolder paste P is 2 to 6 wt %, for example.

The activator can be sebacic acid, succinic acid, adipic acid, glutaricacid, triethanolamine, monoethanolamine, or another organic acid ororganic amine. The amount in which the activator is used in the solderpaste P is 0.01 to 2 wt %, for example.

It is preferable for the solvent to include a first solvent having aboiling point lower than the melting point of the solder powder, and asecond solvent having a boiling point higher than the melting point ofthe solder powder. Even more preferably, the first solvent has a boilingpoint 5 to 50° C. lower than the melting point of the solder powder, andthe second solvent has a boiling point 5 to 50° C. higher than themelting point of the solder powder. The amounts in which the first andsecond solvents are contained in the solder paste P are each about 2 to6 wt %.

Next, as shown in FIGS. 4a and 4 b, the squeegee S is positioned so thatit covers the solder paste P, and this squeegee S is moved so that ittouches the tops of the squeegeeing helper means 6 and the second coverlayer 22. In this process, because the length of the squeegee S and thelength L of the region in which the solder paste P is readied aregreater than the maximum width W of the substrate 1, the squeegee S andthe solder paste P move over all of the openings 23, and the solderpaste P′ drops into all of the openings 23. The squeegee S may also bemoved opposite to its previous movement path in an effort to improve thefilling of the openings 23 with the solder paste P.

The solder paste P used in this embodiment has a small proportion ofsolder powder particles with relatively large diameter as compared tothe thickness of the mask 2. Consequently, even if the squeegee S ismoved back and forth over the mask 2, there is little danger that thesolder powder that has filled the openings 23 will be scraped back outagain by the squeegee S.

The step of finally forming the bumps is carried out by first takingaway the squeegee S and the squeegeeing helper means 6 as shown in FIG.5a, then heat treating the solder paste and removing the mask 2.

In taking away the squeegeeing helper means 6, if the excess solderpaste P that has not filled the openings 23 on the squeegeeing helpermeans 6 is moved back first, then this excess solder paste P can beremoved simultaneously with the squeegeeing helper means 6. Furthermore,when the squeegeeing helper means 6 onto which the solder paste P hasbeen moved is used in the printing of the solder paste P onto the nextsubstrate 1, this solder paste P can be reused.

The heat treatment of the solder paste P is carried out, for example, bysending the printed substrate 1 into a heating furnace after thesqueegee S and the squeegeeing helper means 6 have been removed. Thetemperature in the heating furnace is determined by the type of solderpaste being used (and particularly the solder components), but isroughly 250 to 450° C. This heat treatment melts the solder paste p, butthe molten solder forms a ball due to its surface tension. When thismolten solder is cooled and solidified, spherical bumps B are integratedwith the electrode pads 10 as shown in FIG. 5b.

In this embodiment the solder paste P is one that contains a firstsolvent having a boiling point lower than the melting point of thesolder powder, and a second solvent having a boiling point higher thanthe melting point of the solder powder. Accordingly, since the firstsolvent has already vaporized in the melting of the solder, less heat isrobbed from the solder through heat of vaporization of the solvent afterthe solder begins to melt, the effect being an amelioration of theproblem of unmelted solder powder being left behind. Because a specificamount of the second solvent remains even after the solder has melted,the fluidity of the rosin or other resin component is maintained, theactivator is not carried away as the solvent is vaporized, and theactivator is able to get into all parts of the solder, allowing it toact more effectively. As a result, it is possible to form solder bumpswith a good spherical shape and no variance in size. Also, as discussedabove, the solder powder that has already filled the openings 23 is notscraped away by repeated squeegeeing, so the amount of solder paste P′filling the openings 23 remains constant, and this also contributes toless variance in the size of the bumps.

As shown in FIGS. 5c and 5 d, the removal of the mask 2 is carried outby dissolving away the first cover layer 21 with a treatment liquid suchas water or an aqueous solution, and then peeling the second cover layer22 from the substrate 1. In other words, if the second cover layer 22 isformed from a material that does not dissolve in water, just the firstcover layer 21 will be selectively removed as shown in FIG. 5c. Thiseliminates the adhesion between the second cover layer 22 and thesubstrate, and allows the second cover layer 22 ⁷ to be removed as shownin FIG. 5d.

Naturally, if the first cover layer 21 ⁶ is dissolved by an aqueoussolution that is also capable of dissolving the second cover layer 22 ⁷,this water-soluble second cover layer 22 ⁷ will also be dissolved by theaqueous solution, and the first and second cover layers 21 and 22 can bedissolved away at the same time.

After the mask 2 is removed from the substrate 1, the substrate 1 isseparated from the substrate support 4 as shown in FIG. 5d. Since thesubstrate 1 is merely resting in the recess 40 of the substrate support4, it can be easily taken out of the substrate support 4.

With this embodiment, the mask 2 was provided by forming the coverlayers 21 and 22 from resin or the like, but a metal mask in whichopenings corresponding to the electrode pads have already been made mybe used as the mask, and this mask placed over the substrate. Again whena mask such as this is used, the solder paste P used in this embodimenthas a small proportion of solder powder particles with relatively largediameter as compared to the thickness of the mask, so when the metalmask is removed after the openings have been filled with the solderpaste, there is little danger that the solder paste clinging to theinner walls of the openings will taken away along with the metal mask.Accordingly, variance in the size of the bumps is less likely to occurin a bump formation method that makes use of a metal mask.

Next, the bump formation method pertaining to the second embodiment ofthe present invention will be described through reference to FIGS. 6 and7. FIGS. 6a to 6 f illustrate the bump formation method pertaining tothe second embodiment of the present invention, while FIGS. 7a and 7 bare enlarged detail views of FIGS. 6a and 6 b, respectively. In thisembodiment, solder bumps are formed all at once in a plurality ofregions that will subsequently become individual electronic elements, inthe form of a wafer (substrate) on which electrode pads and wiring havebeen formed.

The object of the bump formation method in this embodiment is to dividethe electrode pads 10 a and 10 b into a plurality of groups as shown inFIG. 6a, and form bumps Ba and Bb of different heights in each group asshown in FIG. 6f. Accordingly, the size of the openings 23 a and 23 bformed in the mask 2 is different for each group, but the basic stepsare the same as in the bump formation method pertaining to the firstembodiment of the present invention. This is described in specific termsbelow.

As shown in FIG. 6a, a plurality of first electrode pads 10 a and aplurality of second electrode pads 10 b are formed on the substrate 1.As shown in FIG. 7a, these electrode pads 10 a and 10 b are formed byforming an insulating film 11 on the substrate 1 so as to expose theareas that will become terminals for wiring (not shown) formed in apattern, and then performing metal plating or the like so as to coverthe exposed areas and their peripheral components. Accordingly, theelectrode pads 10 a and 10 b are shaped such that their center portionsare lower than their peripheral components. It is preferable for thefirst electrode pads 10 a to be formed in a smaller surface area thanthe second electrode pads 10 b so that their will be a good differencein the heights of the bumps Ba and Bb.

As shown in FIG. 6b, a cover layer 2A is formed on the substrate 1 froma photosensitive and insulating resin material so as to cover theelectrode pads 10 a and 10 b, for instance. The cover layer 2A isformed, for example, by forming the above-mentioned resin material as afilm, and subjecting this to hot press bonding over the substrate 1. Thecover layer 2A formed in this manner conforms closely to the insulatingfilm 11, as shown in FIG. 7b. In contrast, because the electrode pads 10a and 10 b are recessed, the cover layer 2A does not conform to thecenters of the electrode pads 10 a and 10 b, and some space is left inbetween.

Examples of the resin material that makes up the cover layer 2A includepolymethyl methacrylate, polyacrylate, and polymethyl isopropenylketone.

Next, just as with the first embodiment of the present invention,exposure and developing treatments are performed on the areascorresponding to the electrode pads 10 a and 10 b in the cover layer 2A.As shown in FIG. 6c, this forms openings 23 a and 23 b corresponding tothe electrode pads 10 a and 10 b in the cover layer 2A, and provides themask 2 over the substrate 1. Here, by forming windows of a specificsurface area in the photomask used for the exposure treatment, firstopenings 23 a of relatively large open surface area and volume areformed in those areas corresponding to the first electrode pads 10 a,while second openings 23 b of relatively small open surface area andvolume are formed in those areas corresponding to the second electrodepads 10 b.

The developing treatment is carried out, for example, by using etchingto remove the areas in the cover layer 2A where the openings 23 a and 23b are to be formed. If the cover layer 2A is floating above the centersof the electrode pads 10 a and 10 b, the cover layer 2A will be suitablyremoved, and as a result the cover layer 2A will not remain behind inthe centers of the electrode pads 10 a and 10 b after the openings 23 aand 23 b have been formed.

After the first and second openings 23 a and 23 b have been formed, theyare filled with solder paste Pa and Pb as shown in FIG. 6d. This fillingwith solder paste Pa and Pb is accomplished by the same printing step asdescribed for the first embodiment of the present invention, forexample. Naturally, the solder paste Pa and Pb can be the same as whatwas used in the first embodiment of the present invention.

Next, the solder paste Pa and Pb filling the openings 23 a and 23 b,respectively, is heated and melted by a heat treatment. This eliminatesthrough volatilization any components such as solvent other than thesolder component contained in the solder paste Pa and Pb, and the soldercomponent is gathered together into an approximate spherical shapethrough surface tension as shown in FIG. 6e. The solder solidifies inthis shape in the subsequent cooling process, forming a plurality ofsolder bumps Ba and Bb affixed to the electrode pads 10 a and 10 b.Here, the first bumps Ba which are relatively taller and larger involume are formed in the first openings 23 a which have a relativelylarge volume, while the second bumps Bb which are relatively shorter andsmaller in volume are formed in the openings second openings 23 b whichhave a relatively small volume.

After this, as shown in FIG. 6f, the mask 2 is removed from thesubstrate 1 by peeling the mask 2 from the substrate 1 or dissolving themask 2 with a suitable solvent.

The substrate (wafer) 1 on which the first bumps Ba and second bumps Bbof different heights have been formed is divided up into individualelectronic element formation regions using a diamond cutter or the like,which provides, for example, an electronic element 7 provided in itscenter with two regions where the shorter second bumps Bb are gathered,and in which the taller first bumps Ba are formed in the other regions,as shown in FIG. 8.

As shown in FIG. 9, for instance, other electronic elements (sub-chips)81 and 82 are mounted on the electronic element (main chip) 7 shown inFIG. 8. These sub-chips 81 and 82 each have a surface area correspondingto a region where the second bumps Bb are gathered, as shown in FIG.10a, and their surfaces are provided with electrode pads 81 a and 82 athat correspond to the second bumps Bb of the main chip 7 and that areelectrically connected to wiring (not shown). A memory LSI, analogelement, or the like is used for each of the sub-chips 81 and 82.

As shown in FIG. 10b, the mounting of the sub-chips 81 and 82 is carriedout by positioning the electrode pads 81 a and 82 a of the sub-chips 81and 82 so that they are facing and in contact with the second bumps Bbof the main chip, then heating and melting the shorter bumps 18, andfinally cooling.

The main chip 7 on which the sub-chips 81 and 82 are mounted is itselfmounted on a rewiring substrate 9 as shown in FIG. 11, for example. Therewiring substrate 9 is provided with a plurality of electrode pads 90corresponding to the first bumps Ba of the main chip 7 and iselectrically connected to wiring (not shown). In this mounting of themain chip 7 to the rewiring substrate 9, as shown in FIG. 12a, first,the main chip 7 is turned over and the first bumps Ba of the main chip 7are positioned with respect to the electrode pads 90 of the rewiringsubstrate 9.

Then, as shown in FIG. 12b, the first bumps Ba of the main chip 7 arebrought into opposition and contact with the various electrode pads 90of the rewiring substrate 9, the first bumps Ba are heated, melted, andcooled in this state, and the main chip 7 is fixed to the rewiringsubstrate 9, thereby forming a multi-chip package X.

Here, the sub-chips 81 and 82 are held between the main chip 7 and therewiring substrate 9. To attain this state as desired, if we take intoaccount the deformation of the first bumps Ba when the main chip 7 ismounted on the rewiring substrate 9, it is preferable for the distancefrom the first electrode pads 10 a of the main chip 7 to the top of thefirst bumps Ba to be at least 1.2 times the distance from the firstelectrode pads 10 a to the outer surface of the sub-chips 81 and 82.

Next, the bump formation method pertaining to the third embodiment ofthe present invention will be described through reference to FIG. 13. Inthis embodiment, solder bumps are formed all at once in a plurality ofregions that will subsequently become individual electronic elements, inthe form of a wafer (substrate) on which electrode pads and wiring havebeen formed.

The object of the bump formation method in this embodiment is to dividethe electrode pads 10 a′ and 10 b′ into a plurality of groups as shownin FIG. 13a, and form bumps Ba′ and Bb′ of different heights in eachgroup as shown in FIG. 13h. Accordingly, the method for forming the mask2 is different from that in the bump formation methods pertaining to thefirst and second embodiments of the present invention, but the basicsteps are the same as in the bump formation methods pertaining to thefirst and second embodiments of the present invention. This is describedin specific terms below.

As shown in FIG. 13a, a plurality of first electrode pads 10 a′ and aplurality of second electrode pads 10 b′ are formed on the substrate 1′.As shown in FIG. 13b, an insulating first cover layer 21′ is formed onthis substrate 1′ so as to cover the electrode pads 10 a′ and 10 b′. Thefirst cover layer 21′ is formed, for example, by performing hot pressbonding on a film formed from an insulating resin material. Examples ofthe resin that makes up the first cover layer 21′ include epoxyacrylate,epoxy, and polyimide.

Next, as shown in FIG. 13c, first openings 21 a′ are formed in the firstcover layer 21′ at positions corresponding to the first electrode pads10 a′ by a known technique, such as photolithography. The first openings21 a′ are formed so that their open surface area is smaller than thesurface area of the first electrode pads 10 a′. Simultaneously with theformation of the first openings 21 a′, the portions of the first coverlayer 21′ corresponding to the regions where the second electrode pads10 b′ were formed are removed to expose the second electrode pads 10 b′.

Then, as shown in FIG. 13d, a second cover layer 22′ is formed so as tocover the first cover layer 21′ and the second electrode pads 10 b′. Thesecond cover layer 22′ can be formed from the same resin material as thecover layer 2A formed in the second embodiment (see FIG. 6b).

Next, as shown in FIG. 13e, a plurality of second and third openings 22a′ and 22 b′ are formed in the second cover layer 22′ by the same methodas in the second embodiment, such as photolithography. The secondopenings 22 b′ are formed at positions corresponding to the secondelectrode pads 10 b′, and have relatively small open surface area andvolume. The third openings 22 a′ are formed at positions correspondingto the first electrode pads 10 a′, are electrically connected to thefirst openings 21 a′, and have a relatively larger open surface area andvolume than the first and second openings 21 a′ and 22 b′.

A mask 2′ is formed by thus forming the first cover layer 21′ and thesecond cover layer 22′, and forming the first to third openings 21 a 40, 22 a′, and 22 b′.

Then, as shown in FIG. 13f, the first to third openings 21 a′, 22 a, and22 b′ are filled with solder paste Pa′ and Pb′. The method described forthe first embodiment of the present invention can be employed forfilling with the solder paste Pa′ and Pb′.

Next, the solder paste Pa′ and Pb′ filling the openings 21 a′, 22 a′,and 22 b′ is melted by heat treatment. This eliminates throughvolatilization any components such as solvent other than the soldercomponent contained in the solder paste Pa′ and Pb′. As shown in FIG.13g, the solder paste Pa′ filling the first openings 21 a′ is meltedwhile inside these openings. The solder component in the solder pastePa′ that fills each of the third openings 22 a′ is gathered together ina substantially spherical shape by its surface tension. In thesubsequent cooling process, this shape is maintained as the solder isaffixed on the first electrode pads 10 a′ via the solder paste Pa′filling the first openings 21 a′, resulting in the first bumps Ba′. Thesolder powder in the solder paste Pb′ filling each of the secondopenings 22 b′ is also gathered together in a substantially sphericalshape by its surface tension, and in the subsequent cooling process,this shape is maintained as the solder is affixed on the secondelectrode pads 10 b′, resulting in the second bumps Bb′.

Finally, as shown in FIG. 13h, the bumps Ba′ and Bb′ are formed on theelectrode pads 10 a′ and 10 b of the substrate 1′ by removing the secondcover layer 22′ from the substrate 1′. Here, the first cover layer 21′is left behind without being removed, and the first bumps Ba′ are formedsuch that they are raised up to the first cover layer 21′. The sphericalportions of the first bumps Ba′ are larger than the second bumps Bb′because the third openings 22 a′ are larger in volume than the secondopenings 22 b′. As a result, the first bumps Ba′ are larger than thesecond bumps Bb′ in terms of the distance from the electrode pads 10 a′and 10 b′ to their tops.

Just as in the second embodiment, the substrate (wafer) 1′ on which thefirst bumps Ba′ and second bumps Bb′ of different heights have beenformed is divided up into individual electronic element formationregions using a diamond cutter or the like. In this electronic element7′, just as with the electronic element 7 in the second embodiment shownin FIG. 8, the shorter second bumps Bb′ are gathered together in thecenter and the taller first bumps Ba′ are formed in the other regions,as is clearly shown in FIG. 13h.

This electronic element (main chip) 7′ can be used in a multi-chippackage X′ with increased density, just as in the second embodiment ofthe present invention.

In this case, first, as shown in FIGS. 14a and 14 b, another electronicelement (sub-chip) 8′ is mounted on the electronic element (main chip)7′. A memory LSI, analog element, or the like is used for this sub-chip8′. The mounting of the sub-chip is carried out by positioning theelectrode pads 80′ provided to the sub-chip 8′ so that they are facingand in contact with the second bumps Bb′ of the main chip 7′, thenheating and melting the second bumps Bb′ in this state, and finallycooling.

The main chip 7′ on which the sub-chip 8′ is mounted is itself mountedon a rewiring substrate 9′ as shown in FIGS. 14c and 14 d, for example.In this mounting of the main chip 7′ to the rewiring substrate 9′, asshown in FIG. 14c, first, the main chip 7′ is turned over and the firstbumps Ba′ of the main chip 7′ are positioned with respect to theelectrode pads 90′ of the rewiring substrate 9′. Then, as shown in FIG.14d, the first bumps Ba′ of the main chip 7′ are brought into oppositionand contact with the various electrode pads 90′ of the rewiringsubstrate 9′, the first bumps Ba′ are heated, melted, and cooled in thisstate, and the main chip 7′ is fixed to the rewiring substrate 9′,thereby forming a multi-chip package X′.

Here, the sub-chip 8′ is held between the main chip 7′ and the rewiringsubstrate 9′. To attain this state as desired, if we take into accountthe deformation of the first bumps Ba′ when the main chip 7′ is mountedon the rewiring substrate 9′, it is preferable for the distance from thefirst electrode pads 10 a′ of the main chip 7′ to the top of the firstbumps Ba′ to be at least 1.2 times the distance from the first iselectrode pads 10 a′ to the outer surface of the sub-chip 8′.

Next, a semiconductor chip (electronic component) 7″ of a fourthembodiment of the present invention, and a multi-chip package X″ thatmakes use of this chip, will be described through reference to FIGS. 15to 17.

As shown in FIG. 15, first electrode pads 10 a″ which have a relativelysmall surface area, second electrode pads 10 b″ which have a relativelylarge surface area, and a wiring component (not shown) which iselectrically connected to these are formed on the surface of the chipsubstrate of a semiconductor chip 7″. Relatively large first bumps Ba″and relatively small second bumps Bb″ are junction-formed on the firstand second electrode pads 10 a″ and 10 b″, respectively.

The semiconductor chip 7″ can be obtained through the same steps as inthe bump formation method pertaining to the second embodiment, with theonly structural difference between a difference in the surface area ofthe first electrode pads 10 a″ and the second electrode pads 10 b″.

With the bump formation method pertaining to the second embodiment, alarger amount of solder paste was placed on the first electrode pads 10a″ than on the second electrode pads 10 b″ (see FIG. 6d). Accordingly,this bump formation method is employed to form relatively tall firstbumps Ba″ on the first electrode pads 10 a″ and relatively short secondbumps Bb″ on the second electrode pads 10 b″.

Because the surface area of the first electrode pads 10 a″ is relativelysmall, the junction surface area of the first bumps Ba″ and the firstelectrode pads 10 a″ is relatively small, so the shape of the firstbumps Ba″ is close to spherical. On the other hand, since the surfacearea of the second electrode pads 10 b″ is relatively large, thejunction surface area of the second bumps Bb″ and the second electrodepads 10 b″ is relatively large, so the second bumps Bb″ have a shape inwhich a relatively large part of the sphere is missing. This means thatwhen a given amount of solder paste is placed on an electrode pad, ataller bump can be formed when the surface area of the electrode pad issmaller. Therefore, a significant difference in the heights of the firstand second bumps Ba″ and Bb″ can also be ensured by providing adifference in the surface areas of the electrode pads 10 a″ and 10 b″,as with the semiconductor chip 7″ of this embodiment.

FIG. 16 is a cross section in which sub-chips 81″ and 82″ are placed onthe semiconductor chip 7″ shown in FIG. 15. The sub-chips 81″ and 82″are each a memory IC or analog element, for example, and have astructure in which electrode pads 81 a″ and 82 a″ corresponding to thesecond bumps Bb″ of the semiconductor chip 7″, and a wiring component(not shown) electrically connected thereto, are formed. The electrodepads 81 a″ and 82 a″ of the sub-chips 81″ and 82″ are electricallyconnected to the second electrode pads 10 b″ of the semiconductor chip7″ through the second bumps Bb″. If we take into account the deformationof the first bumps Ba″ when the semiconductor chip 7″ is placed onanother mounting object, it is preferable for the distance from thefirst electrode pads 10 a″ to the top of the first bumps Ba″ to be atleast 1.2 times the distance from the second electrode pads 10 b″ to theouter surface of the sub-chips 81″ and 82″.

FIG. 17 is a cross section of a multi-chip package (electroniccomponent) X″ in which the above-mentioned semiconductor chip 7″carrying the sub-chips 81″ and 82″ is mounted on a rewiring substrate9″. The rewiring substrate 9″ has a structure in which electrode pads90″ corresponding to the first bumps Ba″ of the semiconductor chip 7″,and a wiring component (not shown) electrically connected thereto, areformed. The electrode pads 90″ of the rewiring substrate 9″ areelectrically connected to the first electrode pads 10 a″ of thesemiconductor chip 7″ through the first bumps Ba″. The sub-chips 81″ and82″ carried on the semiconductor chip 7″ via the second bumps Bb″ fitbetween the semiconductor chip 7″ and the rewiring substrate 9″, whichraises the density of the multi-chip package X″.

EXAMPLES

The present invention will now be described through examples.

In Examples 1 to 7 and Comparative Examples 1 to 4 we discuss therelationship between the particle diameter of the solder powder in thesolder paste, and the variance in the height of the bumps that areformed.

Examples 1˜7

A flux vehicle was prepared by mixing 45 g of Polypale (as rosin), 20 gof 2-methyl-2,4-pentanediol and 20 g of diethylene glycol monobutylether (as solvents), 10 g of sebacic acid (an organic acid; as anactivator), and 5 g of hardened castor oil (as a thixotropic agent). Asolder paste was produced by kneading this flux vehicle in a weightratio of 1:9 with an Sn-3.5%Ag solder powder having the particle sizedistribution shown in Table 2. This solder paste was used to form solderbumps as below.

An acrylate film with a thickness of 50 μm was formed on a wafer having30 semiconductor element formation regions provided with 10,000electrode pads (70×70 μm) at a pitch of 150 μm, and openings with adiameter of 125 μm were formed at positions corresponding to theelectrode pads by exposure and developing to create a mask. Theseopenings were filled with the above-mentioned solder paste, and heatingwas performed at 260° C., which melted the solder paste and integratedthe solder to form bumps. The average bump height and the variance hereare given in Table 2. Variance in Table 2 is indicated by the standarddeviation.

TABLE 2 Particle Powder Powder Powder Powder Powder Pow- Pow- size (μm)1 2 3 4 5 der 6 der 7 >75 0 0 0 0 0 0 0 50 to 75 0 10 8 5 8 8 8 20 to 5030 30 30 30 50 70 90 <20 70 60 62 65 42 22 2 Aver. 16.0 21.0 20.0 19.023.0 26.0 28.0 particle size (μm) Viscosity 180 195 200 220 210 190 175(Pa · s) Aver. 71.8 72.1 72.3 72.6 70.6 70.5 70.1 bump height Variance1.5 1.5 1.7 1.8 1.5 1.8 1.9

Comparative Examples 1˜4

A flux vehicle was prepared by mixing 45 g of Polypale (as rosin), 20 gof 2-methyl-2,4-pentanediol and 20 g of diethylene glycol monobutylether (as solvents), 10 g of sebacic acid (an organic acid; as anactivator), and 5 g of hardened castor oil (as a thixotropic agent). Asolder paste was produced by kneading this flux vehicle in a weightratio of 1:9 with an Sn-3.5%Ag solder powder having the particle sizedistribution shown in Table 3. This solder paste was used to form solderbumps as below.

An acrylate film with a thickness of 50 μm was formed on a wafer having30 semiconductor element formation regions provided with 10,000electrode pads (70 μm diameter) at a pitch of 150 μm, and openings witha diameter of 125 μm were formed at positions corresponding to theelectrode pads by exposure and developing to create a mask. Theseopenings were filled with the above-mentioned solder paste, and heatingwas performed at 260° C., which melted the solder paste and integratedthe solder to form bumps. The average bump height and the variance hereare given in Table 3. Variance in Table 3 is indicated by the standarddeviation.

TABLE 3 Particle Powder Powder Powder Powder size (μm) 8 9 10 11 >75 1 00 5 50 to 75 4 0 0 10 20 to 50 25 20 0 30 <20 70 80 100 55 Aver. 17.014.5 12.5 21.5 particle size (μm) Viscosity 230 250 260 190 (Pa · s)Aver. bump 71.5 71.8 72.0 69.8 height Variance 3.3 3.4 3.6 4.2

As can be seen from Tables 2 and 3, it is preferable for the solderpowder to be such that the proportion of particles whose diameter (50 to75 μm) is at least the thickness of the mask but no more than 1.5 timesthe thickness of the mask is no more than 10 wt %, the proportion ofparticles whose diameter (>50 μm) is at least 40% of the open diameterof the openings is no more than 10 wt %, and the proportion of particleswhose diameter (20 to 50 μm) is 40 to 100% of the mask thickness is atleast 30 wt %.

In Examples 8 to 11 and Comparative Examples 5 to 8, we will examine thevariance in the height of the bumps that are formed as a function of thetype of solvent used for the solder paste.

Example 8

A flux vehicle was prepared by mixing 50 g of Polypale (as rosin), 20 gof 2-methyl-2,4-pentanediol (as a first solvent), 20 g of diethyleneglycol monobutyl ether (as a second solvent), and 10 g of sebacic acid(an organic acid; as an activator). A solder paste was produced bykneading this flux vehicle in a weight ratio of 1:9 with an Sn-3.5%Agsolder powder with an average particle size of 16 μm (powder 1 in Table2). This solder paste was used to form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μmthick) having openings with a diameter of 160 μm at positionscorresponding to the electrode pads of these semiconductor elements wasput in place after being aligned with these semiconductor elements, andthe above-mentioned solder paste was printed onto the electrode pads ofthe wafer. Next, heating was performed at 260° C., which melted thesolder paste and integrated the solder to form bumps.

The bumps thus formed were approximately 80 μm tall, and the differencebetween the maximum and minimum height (hereinafter referred to as“variance”) was 1.2 μm, making these bumps very precise. The residue ofhalogen elements and alkali metal elements in the bumps after this bumpformation was 10 ppm or less, and no effect on the semiconductorelements was seen.

Example 9

A flux vehicle was prepared by mixing 55 g of Polypale (as rosin), 15 gof 2-methyl-2,4-pentanediol (as a first solvent), 20 g of diethyleneglycol monobutyl ether (as a second solvent), and 10 g of succinic acid(an organic acid; as an activator). A solder paste was produced bykneading this flux vehicle in a weight ratio of 1:9 with an Sn-3.5% Agsolder powder with an average particle size of 16 μm (powder 1 in Table2). This solder paste was used to form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μmthick) having openings with a diameter of 160 μm at positionscorresponding to the electrode pads of these semiconductor elements wasput in place after being aligned with these semiconductor elements, andthe above-mentioned solder paste was printed onto the electrode pads ofthe wafer. Next, heating was performed at 260° C., which melted thesolder paste and integrated the solder to form bumps.

The bumps thus formed were approximately 78 μm tall, and the variancewas 1.3 μm, making these bumps very precise. The residue of halogenelements and alkali metal elements in the bumps after this bumpformation was 10 ppm or less, and no effect on the semiconductorelements was seen.

Example 10

A flux vehicle was prepared by mixing 50 g of Polypale (as rosin), 20 gof 2-methyl-2,4-pentanediol (as a first solvent), 20 g of diethyleneglycol monobutyl ether (as a second solvent), and 5 g of sebacic acidand 5 g of succinic acid (organic acids; as activators). A solder pastewas produced by kneading this flux vehicle in a weight ratio of 1:9 withan Sn-3.5% Ag solder powder with an average particle size of 16 μm(powder 1 in Table 2). This solder paste was used to form solder bumpsas below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μmthick) having openings with a diameter of 160 μm at positionscorresponding to the electrode pads of these semiconductor elements wasput in place after being aligned with these semiconductor elements, andthe above-mentioned solder paste was printed onto the electrode pads ofthe wafer. Next, heating was performed at 260° C., which melted thesolder paste and integrated the solder to form bumps.

The bumps thus formed were approximately 81 μm tall, and the variancewas 1.8 μm, making these bumps very precise. The residue of halogenelements and alkali metal elements in the bumps after this bumpformation was 10 ppm or less, and no effect on the semiconductorelements was seen.

Example 11

A flux vehicle was prepared by mixing 45 g of Polypale (as rosin), 20 gof 2-methyl-2,4-pentanediol (as a first solvent), 20 g of diethyleneglycol monobutyl ether (as a second solvent), and 10 g of sebacic acid(an organic acid) and 5 g of triethanolamine (an organic amine) (asactivators). A solder paste was produced by kneading this flux vehiclein a weight ratio of 1:9 with an Sn-3.5% Ag solder powder with anaverage particle size of 16 μm (powder 1 in Table 2). This solder pastewas used to form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μmthick) having openings with a diameter of 160 μm at positionscorresponding to the electrode pads of these semiconductor elements wasput in place after being aligned with these semiconductor elements, andthe above-mentioned solder paste was printed onto the electrode pads ofthe wafer. Next, heating was performed at 260° C., which melted thesolder paste and integrated the solder to form bumps.

The bumps thus formed were approximately 80 μm tall, and the variancewas 1.4 μm, making these bumps very precise. The residue of halogenelements and alkali metal elements in the bumps after this bumpformation was 10 ppm or less, and no effect on the semiconductorelements was seen.

Comparative Example 5

A flux vehicle was prepared by mixing 50 g of Polypale (as rosin), 40 gof just 2-methyl-2,4-pentanediol (as a solvent which has a boiling pointlower than the melting point of the solder powder), and 10 g of sebacicacid (an organic acid; as an activator). A solder paste was produced bykneading this flux vehicle in a weight ratio of 1:9 with an Sn-3.5% Agsolder powder with an average particle size of 16 μm (powder 1 in Table2). This solder paste was used to form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μmthick) having openings with a diameter of 160 μm at positionscorresponding to the electrode pads of these semiconductor elements wasput in place after being aligned with these semiconductor elements, andthe above-mentioned solder paste was printed onto the electrode pads ofthe wafer. Next, heating was performed at 260° C.

The result was a solder that produced solder balls in some locations,etc., and could not be integrated when molten. The bumps thus formedaveraged about 59 μm in height, and the variance was 9 μm, which is poorprecision.

Comparative Example 6

A flux vehicle was prepared by mixing 50 g of Polypale (as rosin), 20 gof 2-methyl-2,4-pentanediol and 20 g of ethylene glycol dibutyl ether(as solvents which have a boiling point lower than the melting point ofthe solder powder), and 10 g of sebacic acid (an organic acid). A solderpaste was produced by kneading this flux vehicle in a weight ratio of1:9 with an Sn-3.5% Ag solder powder with an average particle size of 16μm. This solder paste was used to form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μmthick) having openings with a diameter of 160 μm at positionscorresponding to the electrode pads of these semiconductor elements wasput in place after being aligned with these semiconductor elements, andthe above-mentioned solder paste was printed onto the electrode pads ofthe wafer. Next, heating was performed at 260° C.

The result was a solder that produced solder balls in some locations,etc., and could not be integrated when molten. The bumps, thus formedaveraged about 50 μm in height, and the variance was 12 μm, which ispoor precision.

Comparative Example 7

A flux vehicle was prepared by mixing 50 g of Polypale (as rosin), 40 gof diethylene glycol monobutyl ether (as a solvent which has a boilingpoint higher than the melting point of the solder powder), and 10 g ofsebacic acid (an organic acid; as an activator). A solder paste wasproduced by kneading this flux vehicle in a weight ratio of 1:9 with anSn-3.5% Ag solder powder with an average particle size of 16 μm (powder1 in Table 2). This solder paste was used to form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μm)having openings with a diameter of 160 μm at positions corresponding tothe electrode pads of these semiconductor elements was put in placeafter being aligned with these semiconductor elements, and theabove-mentioned solder paste was printed onto the electrode pads of thewafer. Next, heating was performed at 260° C.

The result was that solder powder which was unmelted and therefore notintegrated remained on the bump surfaces, and the desired bumps couldnot be formed.

Comparative Example 8

A flux vehicle was prepared by mixing 50 g of Polypale (as rosin), 20 gof 1,5-pentanediol and 20 g of diethylene glycol monobutyl ether (assolvents which have a boiling point higher than the melting point of thesolder powder), and 10 g of sebacic acid (an organic acid; as anactivator). A solder paste was produced by kneading this flux vehicle ina weight ratio of 1:9 with an Sn-3.5% Ag solder powder with an averageparticle size of 16 μm (powder 1 in Table 2). This solder paste was usedto form solder bumps as below.

Solder bumps were formed by metal mask printing on a wafer having 30semiconductor element formation regions provided with 10,000 electrodepads (70 μm diameter) at a pitch of 200 μm. First, a metal mask (40 μm)having openings with a diameter of 160 μm at positions corresponding tothe electrode pads of these semiconductor elements was put in placeafter being aligned with these semiconductor elements, and theabove-mentioned solder paste was printed onto the electrode pads of thewafer. Next, heating was performed at 260° C.

The result was that solder powder which was unmelted and therefore notintegrated remained on the bump surfaces, and the desired bumps couldnot be formed.

In Examples 12 to 20, we will discuss the bump formation methodpertaining to the first embodiment described previously.

Example 12

In this example, bumps were formed by the following method. First, asilicon wafer with a thickness of 0.6 mm and a diameter of 6 inches(approximately 15.3 cm), and having semiconductor element formationregions provided with 10,000 electrode pads (70 μm diameter) at a pitchof 150 μm, was coated by spin coating with an aqueous solutioncontaining 5.0 wt % polyvinyl alcohol, after which this was heated for30 minutes at about 110° C. to form a first cover layer with a thicknessof about 0.1 μm. A photosensitive acrylate resin film with a thicknessof 50 μm (trade name: NIT-250, made by Nichigo Morton) was applied byhot press bonding at 105° C. and 3.5 kg/mm² to form a second coverlayer.

This second cover layer was exposed through a mask in which the opaqueportion was formed at positions corresponding to the electrode pads, andthe region irradiated with light was polymerized. The exposed secondcover layer was developed with an aqueous solution (etchant) containing2.3 vol % tetramethylammonium hydroxide, which removed the portions notirradiated with light and created openings with a diameter of 125 μm.Here, because the previous etchant was an aqueous solution and the firstcover layer was formed from a water-soluble resin, the portionscorresponding to the electrode pads in the first cover layer were alsoremoved at the same time, and openings were also formed in this firstcover layer, exposing the electrode pads.

After this, the openings in the first and second cover layers werefilled by printing with an Sn-3.5% Ag solder powder with an averageparticle size of 16 μm (powder 1 in Table 2), and the solder wassolidified after reflow at 265° C. Next, the first and second coverlayers were each dissolved away with a 5.0 vol % monoethanolamineaqueous solution. As a result, bumps 75±1.5 μm in height were formed.

Example 13

In this example, bumps were formed in the same manner as in Example 12,except that an aqueous solution containing 5.0 wt % polyacrylic acid wasapplied by spin coating, after which this coating was heated for 30minutes at about 110° C. to form a first cover layer with a thickness ofabout 0.1 μm. As a result, bumps 75±1.5 μm in height were formed.

Example 14

In this example, first and second cover layers were formed and openingswere formed in these cover layers in the same manner as in Example 12.After this, the insides of the openings were coated with flux, thenfilled with an Sn-3.5% Ag solder powder with an average particle size of15 μm (powder 1 in Table 2), and this solder powder was solidified afterreflow at 265° C. Next, the first and second cover layers were eachdissolved away with a 5.0 vol % monoethanolamine aqueous solution. As aresult, bumps 80±2.0 μm in height were formed.

Example 15

In this example, first and second cover layers were formed and openingswere formed in these cover layers in the same manner as in Example 12.The thickness of the second cover layer, however, was changed to 25 μm.After this, the insides of the through holes were coated with flux, andthe substrate was dipped in a 280° C. molten solder bath (Sn-3.5% Ag)The first and second cover layers were each dissolved away with a 5.0vol % monoethanolamine aqueous solution. As a result, bumps 75±2.5 μm inheight were formed.

Example 16

In this example, first and second cover layers were formed and openingswere formed in these cover layers in the same manner as in Example 15.After this, the insides of the openings were filled with solder (Sn-3.5%Ag) by plating and then coated with flux, and this was solidified afterreflow at 265° C. The first and second cover layers were each dissolvedaway with a 5.0 vol % monoethanolamine aqueous solution. As a result,bumps 75±1.0 μm in height were formed.

Example 17

In this example, bumps were formed by the following method. First, asilicon wafer with a thickness of 0.6 mm and a diameter of 6 inches(approximately 15.3 cm), and on which a total of 300,000 circularelectrodes with a diameter of 70 μm had been formed at a pitch of 150μm, was placed as a substrate on a Teflon substrate support (200×200×2mm).

Next, a photosensitive acrylate resin film (trade name: NIT-250, made byNichigo Morton) was applied by hot press bonding at 100° C. and 3.5kg/mm² to form a cover layer. This cover layer was exposed through amask in which the opaque portion was formed at positions correspondingto the electrode pads, and the region irradiated with light waspolymerized. The exposed cover layer was developed with an aqueoussolution (etchant) containing 2.3 vol % tetramethylammonium hydroxide,which removed the portions not irradiated with light, formed openingswith a diameter of 125 μm, and created a mask.

After this, a plate with a thickness of 0.6 mm and having an opening ofsubstantially the same shape as the silicon wafer was disposed so as tosurround the substrate. The openings in the cover layer were then filledby printing with a solder paste (in which the solder powder was anSn-3.5% Ag solder powder with an average particle size of 16 μm (powder1 in Table 2)), after which the plate was taken away and the solderpaste was solidified after reflow at 265° C. The first and second coverlayers were dissolved away with a 5.0 vol % monoethanolamine aqueoussolution. As a result, bumps 75±1.5 μm in height were formed.

Example 18

In this example, a silicon wafer was fixed to a substrate support havingan opening corresponding to the plan view surface area of the siliconwafer, and in which a recess 0.45 mm deep was formed, such that thelower part of this wafer fit into this recess. In this state, a coverlayer was formed in the same manner as in Example 17, and openings wereformed in this cover layer in a pattern corresponding to the electrodepads of the substrate, creating a mask.

Next, a plate with a thickness of 0.15 mm and having an opening ofsubstantially the same shape as the silicon wafer was disposed so as tosurround the substrate. The openings were then filled with solder, thesolder was solidified after reflow, and the cover layer was removed, allin the same manner as in Example 17. As a result, bumps 75±1.5 μm inheight were formed.

Example 19

In this example, other than using a substrate support made fromstainless steel, bumps were formed in the same manner as in Example 17.As a result, bumps 75±1.5 μm in height were formed.

Example 20

In this example, other than using a substrate support made fromstainless steel, bumps were formed in the same manner as in Example 18.As a result, bumps 75±1.5 μm in height were formed.

In Example 21 to 23, we will discuss the bump formation methodpertaining to the second embodiment of the present invention.

Example 21

800 first electrode pads (used for electrical connection to a rewiringsubstrate; electrode diameter: 80 μm; pitch: 220 μm) and 100×2 secondelectrode pads (used for electrical connection to sub-chips; electrodediameter: 110 μm; pitch: 220 μm) were formed on the surface of a chipsubstrate, and the resulting semiconductor chip was used as a main chip.

A photosensitive polymethyl methacrylate insulating film (thickness: 100μm) was laid over this main chip so as to cover the first and secondelectrode pads. Exposure and developing were carried out to form firstopenings at places corresponding to the first electrode pads in thisfilm, and form second openings at places corresponding to the secondelectrode pads, creating a mask. The open diameter of the first openingswas 200 μm, while that of the second openings was 50 μm. The first andsecond openings were filled with solder paste containing an Sn-3.5% Agsolder powder with an average particle size of 16 μm (powder 1 in Table2) in an amount of 55 vol % , after which this was heated at 260° C. tomelt and integrate the solder powder in the solder paste.

Next, the insulating film was chemically removed using a 10 wt %monoethanolamine aqueous solution. After this, the bumps were coatedwith a flux containing 50 wt % Polypale (as rosin) and 50 wt % hexyleneglycol (as a solvent), and this was heated again at 260° C. to adjustthe shape of the bumps.

As a result, first bumps 161 μm tall were formed on the first electrodepads used for electrical connection to the rewiring substrate, whilesecond bumps 30 μm tall were formed on the second electrode pads usedfor electrical connection to the sub-chips.

Next, two semiconductor chips (thickness: 100 μm) serving as sub-chipscomprising 100 electrode pads on a chip substrate were placed on thesecond bump group of the main chip, that is, the short bump group inwhich the height was 30 μm (100 of these bumps), while being heated at260° C. This main chip was then turned over and placed on a rewiringsubstrate via the first bumps, that is, the tall bumps with a height of161 μm, again while being heated at 260° C.

As a result, a good connection was formed between the main chip and therewiring substrate, while the two sub-chips were held between the mainchip and the rewiring substrate.

Example 22

800 first electrode pads (used for electrical connection to a rewiringsubstrate; electrode diameter: 100 μm; pitch: 300 μm) and 100×2 secondelectrode pads (used for electrical connection to sub-chips; electrodediameter: 80 μm; pitch: 153 μm) were formed on the surface of a chipsubstrate, and the resulting semiconductor chip was used as a main chip.A photosensitive polymethyl methacrylate insulating film (thickness: 50μm) was laid over this main chip so as to cover the first and secondelectrode pads. Exposure and developing were carried out to form firstand second openings at places corresponding to the various electrodepads in this film. The open diameter of the first openings over thefirst electrode pads was 280 μm, while that of the second openings overthe second electrode pads was 50 μm.

The first and second openings were filled with solder paste containingan Sn-3.5% Ag solder powder with an average particle size of 16 μm(powder 1 in Table 2) in an amount of 55 vol % , after which this washeated at 260° C. to melt and integrate the solder powder in the solderpaste. Next, the insulating film was chemically removed using a 10 wt %monoethanolamine aqueous solution. After this, the bumps were coatedwith a flux containing 50 wt % Polypale (as rosin) and 50 wt % hexyleneglycol (as a solvent), and this was heated again at 260° C. to adjustthe shape of the bumps.

As a result, bumps 154 μm tall were formed on the first electrode padsused for electrical connection to the rewiring substrate, while bumps 28μm tall were formed on the second electrode pads used for electricalconnection to the sub-chips.

Next, two semiconductor chips (thickness: 100 μm) serving as sub-chipscomprising 100 electrode pads on a chip substrate were placed on thesecond bump group of the main chip, that is, the short bump group inwhich the height was 28 μm (100 of these bumps), while being heated at260° C. This main chip was then turned over and placed on a rewiringsubstrate via the first bumps, that is, the tall bumps with a height of154 μm, again while being heated at 260° C.

As a result, a good connection was formed between the main chip and therewiring substrate, while the two sub-chips were held between the mainchip and the rewiring substrate.

Example 23

800 first electrode pads (used for electrical connection to a rewiringsubstrate; electrode diameter: 100 μm; pitch: 300 μm) and 100×2 secondelectrode pads (used for electrical connection to sub-chips; electrodediameter: 80 μm; pitch: 153 μm) were formed on the surface of a chipsubstrate, and the resulting semiconductor chip was used as a main chip.

A photosensitive polymethyl methacrylate insulating film (thickness: 50μm) was laid over this main chip so as to cover the electrode pads.Exposure and developing were carried out to first and second openings atplaces corresponding to the first and second electrode pads in thisfilm. The open diameter of the first openings over the first electrodepads was 280 μm, the open diameter of the number 2-1 openings over thefirst group of second electrode pads (100 pads) was 50 μm, and the opendiameter of the number 2-2 openings over the second group of secondelectrode pads (100 pads) was 40 μm.

The various openings were filled with solder paste containing an Sn-3.5%Ag solder powder with an average particle size of 16 μm (powder 1 inTable 2) in an amount of 55 vol % , after which this was heated at 260°C. to melt and integrate the solder powder in the solder paste. Next,the insulating film was chemically removed using a 10 wt %monoethanolamine aqueous solution. After this, the bumps were coatedwith a flux containing 50 wt % Polypale (as rosin) and 50 wt % hexyleneglycol (as a solvent), and this was heated again at 260° C. to adjustthe shape of the bumps.

As a result, the first bumps 154 μm tall were formed on the firstelectrode pads used for electrical connection to the rewiring substrate,while bumps 28 μm and 18 μm tall (numbers 2-1 and 2-2) were respectivelyformed on the first and second groups of second electrode pads used forelectrical connection to the sub-chips.

Next, a first semiconductor chip (thickness: 100 μm) and a secondsemiconductor chip (thickness: 105 μm) serving as sub-chips comprising100 electrode pads on a chip substrate were respectively placed on thenumber 2-1 bumps of the main chip, that is, the bumps 28 μm tall (100 ofthese bumps), and on the number 2-2 bumps, that is the bumps 18 μm tall(100 of these bumps), while being heated at 260° C. This main chip wasthen turned over and placed on a rewiring substrate via the first bumps,that is, the tall bumps with a height of 154 μm, again while beingheated at 260° C.

As a result, a good connection was formed between the main chip and therewiring substrate, while the two sub-chips were held between the mainchip and the rewiring substrate.

What is claimed is:
 1. An electronic component, comprising: a substrate;a plurality of first electrode pads and a plurality of second electrodepads formed on the same surface of this substrate; a plurality of firstbumps formed in a pattern corresponding to the plurality of firstelectrode pads; and a plurality of second bumps formed in a patterncorresponding to the plurality of second electrode pads, wherein thesurface area of each of the first electrode pads is smaller than thesurface area of each of the second electrode pads, and the top of eachof the first bumps is located higher than the top of each of the secondbumps.
 2. An electronic component as claimed in claim 1, furthercomprising a mounting object, wherein this mounting object is placed onthe substrate with the plurality of second bumps therebetween, and thetop of each of the first bumps is located at a height of at least 1.2times the height location of the top of the mounting object.
 3. Anelectronic component as claimed in claim 2, further comprising anadditional mounting object, wherein this additional mounting object isplaced on the substrate via the plurality of first bumps in a state inwhich the original mounting object is interposed between the additionalmounting object and the substrate.
 4. An electronic component as claimedin claim 2, wherein the substrate is mounted on another substrate viathe plurality of first bumps in a state in which the mounting object isinterposed between the original substrate and the other substrate.
 5. Anelectronic component, comprising: a substrate; a plurality of firstelectrode pads and a plurality of second electrode pads formed on thesame surface of this substrate; a cover layer formed in the region ofthe substrate where the plurality of first electrode pads are formed,and having a plurality of openings corresponding to the plurality offirst electrode pads; a plurality of first bumps provided in a patterncorresponding to the plurality of first electrode pads, with sphericalportions protruding from the cover layer; and a plurality of secondbumps provided in a pattern corresponding to the plurality of secondelectrode pads, with spherical portions formed directly on thecorresponding second electrode pads, wherein the top of each of thefirst bumps is located higher than the top of each of the second bumps.6. An electronic component as claimed in claim 5, wherein the coverlayer contains at least one type of resin selected from the groupconsisting of epoxyacrylate, epoxy, and polyimide.
 7. An electroniccomponent as claimed in claim 5, further comprising a mounting object,wherein this mounting object is placed on the substrate with theplurality of second bumps therebetween, and the top of each of the firstbumps is located at a height of at least 1.2 times the height locationof the top of the mounting object.
 8. An electronic component as claimedin claim 7, further comprising an additional mounting object, whereinthis additional mounting object is placed on the substrate via theplurality of first bumps in a state in which the original mountingobject is interposed between the additional mounting object and thesubstrate.
 9. An electronic component as claimed in claim 7, wherein thesubstrate is mounted on another substrate via the plurality of firstbumps in a state in which the mounting object is interposed between theoriginal substrate and the other substrate.